News and New Products
A New Reworkable Edgebond
Adhesive Enhances Board Level Reliability of Large WLCSP
A new reworkable edgebond adhesive from Zymet has been shown to enhance the board-level reliability of a large
wafer-level chip-scale package (WLCSP). The work was performed in a collaborative effort between Portland
State University, Cisco, and Zymet, and published in the Proceedings of the SMTA International 2016
conference, which took place in Rosemont, IL.
Reworkable Edgebond Adhesive Dramatically Enhances Board Level
Reliability of Area Array Packages
A new approach to enhancing the board level reliability of area array packages was presented at the recent
Reworkable Underfill Enhances Board Level Thermal
Cycling of IC Packages, Zymet CN-1735
Zymet has introduced a new reworkable low-CTE underfill encapsulant, CN-1735, designed to enhance the board
level thermal cycle performance of IC packages with pitches as fine as 0.3- mm pitch.
Announces Highly Crack Resistant Underfill for Thin, Flexible Assemblies, CN-1751-4
Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4....
Zymet Announces Reworkable
Underfill for 0.4-mm Pitch POP's
Zymet has introduced a new reworkable underfill encapsulant, CN-1736....
Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle
Performance and Eliminates Underfill
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of
CBGAs and plastic BGAs....
Reworkable Underfill for Package-on-Package (POP)
Zymet has introduced a new reworkable underfill encapsulant, CN-1728....
Reworkable Underfill Encapsulant for BGAs and CSPs
Zymet has introduced a new reworkable underfill encapsulant, CN-1703, designed for CSP and BGA
Underfill Encapsulant for BGAs, CSPs and WL-CSPs
Zymet has introduced a new underfill encapsulant, CSP-1412, designed for BGA, CSP, and WL-CSP
Reworkable Underfill Encapsulant for BGAs
Zymet has introduced a new reworkable BGA underfill encapsulant, CN-1453....
Ultra-Low Stress Die Attach Adhesive for Stress Sensitive Devices
Zymet is offering an ultra-low stress die attach adhesive, TC-601.1, uniquely suited for bonding of stress
UV Curable Encapsulant for High Reliability IC Encapsulation
Zymet has introduced a high reliability UV curable encapsulant for IC encapsulation....
UV Curable Cavity-fill Encapsulant for High Reliability IC
Zymet has introduced a high reliability UV curable encapsulant for cavity-fill IC encapsulation....
Fast Flow Underfill Encapsulant for CSPs and BGAs
Zymet has developed a fast flow underfill encapsulant, designated X6-82-5LV.....