• Reworkable Edgebond Adhesives

    To ruggedize electronics for harsh environments
    and to enhance thermal cycle performance

  • Anisotropically Conductive Adhesives

    For flip chip attachment or electrical grounding

  • Electrically Conductive Adhesives

    For die attach and general electronics assembly

  • Thermally Conductive Adhesives

    For heat dissipation

  • Non-conductive Pastes (NCPs)

    For flip chip attachment of RFID and smartcard IC's

  • Optoelectronics Adhesives

    For applications such as fiber assembly, connector,
    or ferrule assembly, VCSEL assembly, Bragg Grating assembly,
    and many others

  • Ultra-Low Stress Adhesives

    For bonding of stress sensitive devices

  • Underfill Encapsulants

    To enhance the thermal cycle performance of flip chips

  • Reworkable Underfill Encapsulants

    Enhance the board level reliability of these
    area array packages in harsh environments

  • UV Curable Glob Top and
    Dam-and-Fill Encapsulants

    To permit the use of low cost substrates that cannot
    tolerate exposure to high temperatures

  • Reworkable Edgebond Adhesives

    To ruggedize electronics for harsh environments
    and to enhance thermal cycle performance

  • Anisotropically Conductive Adhesives

    For flip chip attachment or electrical grounding

  • Electrically Conductive Adhesives

    For die attach and general electronics assembly

  • Thermally Conductive Adhesives

    For heat dissipation

  • Non-conductive Pastes (NCPs)

    For flip chip attachment of RFID and smartcard IC's

  • Optoelectronics Adhesives

    For applications such as fiber assembly, connector, or ferrule assembly, VCSEL assembly, Bragg Grating assembly and many others

  • Ultra-Low Stress Adhesives

    For bonding of stress sensitive devices

  • Underfill Encapsulants

    To enhance the thermal cycle performance of flip chips

  • Reworkable Underfill Encapsulants

    Enhance the board level reliability of these area array packages in harsh environments

  • UV Curable Glob Top and Dam-and-Fill Encapsulants

    To permit the use of low cost substrates that cannot tolerate exposure to high temperatures