Underfill Encapsulants

Underfill Encapsulants for Flip Chips

Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to achieve the fast, void free encapsulation.

Features include:

• Flow into gaps as fine as 18 microns
• Fast inline cure, or longer conventional oven cure
• CTE's ranging from 23 ppm/ºC to 40 ppm/ºC
• Excellent adhesion to organic substrates and to die passivations
• Excellent fracture toughness to resist cracks and crack propagation