新闻和新产品

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill (.pdf)

Reworkable Underfill for Package-on-Package (POP) (.pdf)

Reworkable Underfill Encapsulant for BGAs and CSPs (.pdf)

Underfill Encapsulant for BGAs, CSPs and WL-CSPs (.pdf)

Reworkable Underfill Encapsulant for BGAs (.pdf)

Ultra-Low Stress Die Attach Adhesive for Stress Sensitive Devices (.pdf)

UV Curable Encapsulant for High Reliability IC Encapsulation (.pdf)

UV Curable Cavity-fill Encapsulant for High Reliability IC Encapsulation (.pdf)

Fast Flow Underfill Encapsulant for CSPs and BGAs (.pdf)